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march 2010 doc id 10890 rev 6 1/44 1 vn820-e high-side driver features ecopack ? : lead free and rohs compliant automotive grade: compliance with aec guidelines very low stadby current cmos compatible input on-state open-load detection off-state open-load detection thermal shutdown protection and diagnosis undervoltage shutdown overvoltage clamp output stuck to v cc detection load current limitation reverse battery protection (see figure 24 ) electrostatic discarge protection description the vn820-e is a monolithic device designed in stmicroelectronic's vipower? m0-3 technology. the vn820-e is intended for driving any type of load with one side connected to ground. the active v cc pin voltage clamp protects the device against low energy spikes (see iso7637 transient compatibility table). active current limitatio n combined with thermal shutdown and automatic restart protects the device against overload. the device detects the open-load condition in both the on and off-state. in the off-state the device detects if the output is shorted to v cc . the device automatically turns off in the case where the ground pin becomes disconnected. type r ds(on) i out v cc vn820-e vn820sp-e vn820b5-e vn820pt-e vn820-12-e VN820-11-E 40 m 9a 36v ppak pentawatt p 2 pak 1 10 powerso-10 table 1. device summary package order codes tube tape and reel pentawatt vn820-e vn820-12-e VN820-11-E - powerso-10 vn820sp-e vn820sptr-e p 2 pak vn820b5-e vn820b5tr-e ppak vn820pt-e vn820pttr-e www.st.com
contents vn820-e 2/44 doc id 10890 rev 6 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.4 electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.1 gnd protection network against reverse battery . . . . . . . . . . . . . . . . . . . 18 3.1.1 solution 1: resistor in the ground line (rgnd only) . . . . . . . . . . . . . . . . 18 3.1.2 solution 2: diode (dgnd) in the ground line . . . . . . . . . . . . . . . . . . . . . 19 3.2 load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.3 mcu i/os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.4 open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.5 powerso-10, p 2 pak, ppak, pentawatt maximum demagnetization energy (v cc = 13.5v) 21 4 package and pcb thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.1 p 2 pak thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.2 ppak thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.3 powerso-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 5 package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.1 ecopack ? packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.2 pentawatt mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5.3 p 2 pak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 5.4 ppak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 5.5 powerso-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 5.6 pentawatt packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.7 p 2 pak packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.8 ppak packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
vn820-e contents doc id 10890 rev 6 3/44 5.9 powerso-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
list of tables vn820-e 4/44 doc id 10890 rev 6 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 7 table 3. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 4. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 5. power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 6. switching (v cc = 13 v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 7. input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 8. v cc output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 9. status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 10. protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 11. open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 12. truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 13. electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 14. p 2 pak thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 15. ppak thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 16. powerso-10 thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 0 table 17. pentawatt mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 table 18. p 2 pak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 table 19. ppak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 table 20. powerso-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 table 21. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
vn820-e list of figures doc id 10890 rev 6 5/44 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 2. configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 3. current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 4. status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 5. switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 6. waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 7. off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 8. high-level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 9. input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 10. status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 11. status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 12. status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 13. on-state resistance vs t case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 14. on-state resistance vs v cc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 15. open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 16. input high-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 17. input low-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 18. input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 19. overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 20. open-load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 21. turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 22. turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 23. ilim vs tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 24. application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 25. open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 26. powerso-10, p 2 pak, ppak, pentawatt maximum turn-o ff current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 27. p 2 pak pc board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 28. p 2 pak rthj-amb vs pcb copper area in open box free air conditions . . . . . . . . . . . . . . . 22 figure 29. p 2 pak thermal impedance junction ambien t single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 30. thermal fitting model of a single channel hsd in p 2 pak. . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 31. ppak pc board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 figure 32. ppak rthj-amb vs pcb copper area in open box free ai r conditions . . . . . . . . . . . . . . . . 25 figure 33. ppak thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 26 figure 34. thermal fitting model of a single channel hsd in ppak . . . . . . . . . . . . . . . . . . . . . . . . . . 26 figure 35. powerso-10 pc board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 figure 36. powerso-10 rthj-amb vs pcb copper area in open box free air conditions . . . . . . . . . . . 28 figure 37. powerso-10 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . 29 figure 38. thermal fitting model of a single channel hsd in powerso-10 . . . . . . . . . . . . . . . . . . . . . 29 figure 39. pentawatt package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 figure 40. p 2 pak package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 figure 41. ppak package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 figure 42. powerso-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 figure 43. pentawatt tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 figure 44. p 2 pak tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 figure 45. p 2 pak tape and reel (suffix ?tr?). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 figure 46. ppak suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 figure 47. ppak tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
list of figures vn820-e 6/44 doc id 10890 rev 6 figure 48. ppak tape and reel (suffix ?tr?) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 figure 49. powerso-10 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 figure 50. powerso-10 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 figure 51. powerso-10 tape and reel shipment (suffix ?tr?) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
vn820-e block diagram and pin description doc id 10890 rev 6 7/44 1 block diagram and pin description figure 1. block diagram figure 2. configurati on diagram (top view) table 2. suggested connections for unused and not connected pins connection / pin status n.c. output input floating x x x x to ground x through 10 k resistor undervoltage overtemperature v cc gnd input output overvoltage current limiter logic driver power clamp status v cc clamp on - state open-load off - state open-load and output shorted to v cc detection detection detection detection detection output status v cc input gnd 5 4 3 2 1 ppak / p2pak/ pentawatt 1 2 3 4 5 6 7 8 9 10 11 output output output output ground input status n.c. n.c. v cc output powerso-10
electrical specifications vn820-e 8/44 doc id 10890 rev 6 2 electrical specifications figure 3. current and voltage conventions 2.1 absolute maximum ratings stressing the device above the rating listed in the ?absolute maximum ratings? table may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not imp lied. exposure to absolute ma ximum rating conditions for extended periods may affect device reliability. refer also to the st microelectronics sure program and other relevant quality document. input i s i in v in v cc status i stat v stat gnd v cc i out v out i gnd output v f table 3. absolute maximum ratings symbol parameter value unit powerso-10 pentawatt p 2 pak ppak v cc dc supply voltage 41 v -v cc reverse dc supply voltage - 0.3 v -i gnd dc reverse ground pin current - 200 ma i out dc output current internally limited a -i out reverse dc output current - 9 a i in dc input current +/- 10 ma i stat dc status current +/- 10 ma v esd electrostatic discharge (human body model: r = 1.5 k ; c = 100 pf) ? input ?status ?output ?v cc 4000 4000 5000 5000 v v v v
vn820-e electrical specifications doc id 10890 rev 6 9/44 2.2 thermal data e max maximum switching energy (l = 1.4 mh; r l = 0 ; v bat = 13.5 v; t jstart = 150 oc; i l = 13 a) 156 mj p tot power dissipation t c = 25 c 65.8 w t j junction operating temper ature internally limited c t c case operating temperature - 40 to 150 c t stg storage temperature - 55 to 150 c table 3. absolute maximum ratings (continued) symbol parameter value unit powerso-10 pentawatt p 2 pak ppak table 4. thermal data symbol parameter max. value unit powerso-10 pentawatt p 2 pak ppak r thj-case thermalresistance junction-case 1.9 1.9 1.9 1.9 c/w r thj-lead thermalresistance junction-lead ----c/w r thj-amb thermalresistance junction-ambient 51.9 (1) 1. when mounted on a standard single-sided fr-4 board with 0.5cm 2 of cu (at least 35m thick). 61.9 (2) 51.9 (2) 76.9 (2) c/w 37 (2) 2. when mounted on a standard single-sided fr-4 board with 6cm 2 of cu (at least 35m thick). -37 (4) 45 (4) c/w
electrical specifications vn820-e 10/44 doc id 10890 rev 6 2.3 electrical characteristics values specified in this section are for 8 v < v cc < 36 v; -40 c < t j < 150 c, unless otherwise stated. table 5. power symbol parameter test conditions min. typ. max. unit v cc operating supply voltage 5.5 13 36 v v usd undervoltage shutdown 3 4 5.5 v v usdhyst undervoltage shutdown hysteresis 0.5 v v ov overvoltage shutdown 36 v r on on-state resistance i out = 3 a; t j = 25 c; v cc > 8 v i out = 3 a; v cc > 8 v 40 80 m m i s supply current off-state; v cc = 13 v; v in = v out = 0 v off-state; v cc = 13 v; v in = v out = 0 v; t j = 25 c on-state; v cc = 13 v; v in = 5 v; i out = 0 a 10 10 2 25 20 3.5 a a ma i l(off1) off-state output current v in = v out = 0 v 0 50 a i l(off2) off-state output current v in = 0 v; v out = 3.5 v -75 0 a i l(off3) off-state output current v in = v out = 0 v; v cc = 13 v; t j = 125c 5a i l(off4) off-state output current v in = v out = 0 v; v cc = 13 v; t j = 25 c 3a table 6. switching (v cc =13v) symbol parameter test conditions min. typ. max. unit t d(on) turn-on delay time r l = 4.3 from v in rising edge to v out = 1.3 v 30 s t d(off) turn-off delay time r l = 4.3 from v in falling edge to v out = 11.7 v 30 s dv out /dt (on) turn-on voltage slope r l = 4.3 from v out = 1.3 v to v out =10.4 v see figure 21 v/s dv out /dt (off) turn-off voltage slope r l = 4.3 from v out = 11.7 v to v out = 1.3 v see figure 22 v/s
vn820-e electrical specifications doc id 10890 rev 6 11/44 table 7. input pin symbol parameter test conditions min. typ. max. unit v il input low-level 1.25 v i il low-level input current v in = 1.25 v 1 a v ih input high-level 3.25 v i ih high-level input current v in = 3.25 v 10 a v hyst input hysteresis voltage 0.5 v v icl input clamp voltage i in = 1m a i in = -1m a 66.8 - 0.7 8v v table 8. v cc output diode symbol parameter test conditions min. typ. max. unit v f forward on voltage - i out = 2 a; t j = 150 c - - 0.6 v table 9. status pin symbol parameter test conditions min. typ. max. unit v stat status low output voltage i stat = 1.6 ma 0.5 v i lstat status leakage current normal operation; v stat = 5 v 10 a c stat status pin input capacitance normal operation; v stat = 5 v 100 pf v scl status clamp voltage i stat = 1m a i stat = - 1m a 66.8 - 0.7 8v v table 10. protections (1) 1. to ensure long term reliability under heavy overload or s hort circuit conditions, protection and related diagnostic signals must be used together with a pro per software strategy. if the device operates under abnormal conditions this software must limit the duration and number of activation cycles. symbol parameter test conditions min. typ. max. unit t tsd shutdown temperature 150 175 200 c t r reset temperature 135 c t hyst thermal hysteresis 7 15 c t sdl status delay in overload condition t j > t jsh 20 ms i lim current limitation 9v < v cc < 36 v 5.5 v < v cc < 36 v 91320 20 a a v demag turn-off output clamp voltage i out = 3 a; v in = 0v; l = 6 mh v cc - 41 v cc - 48 v cc - 55 v
electrical specifications vn820-e 12/44 doc id 10890 rev 6 figure 4. status timings figure 5. switching time waveforms table 11. open-load detection symbol parameter test conditions min. typ. max. unit i ol open-load on-state detection threshold v in = 5 v 70 150 300 ma t dol(on) open-load on-state detection delay i out = 0 a 200 s v ol open-load off-state voltage detection threshold v in = 0 v 1.5 2.5 3.5 v t dol(off) open-load detection delay at turn-off 1000 s v in v stat t dol(off) open-load status timing (with external pull-up) overtemp status timing i out < i ol v out > v ol t dol(on) t j > t jsh v in v stat t sdl t sdl t t v out v in 80% 10% dv out /dt (on) t d(off) 90% dv out /dt (off) t d(on)
vn820-e electrical specifications doc id 10890 rev 6 13/44 table 12. truth table conditions input output status normal operation l h l h h h current limitation l h h l x x h (t j < t tsd ) h (t j > t tsd ) l overtemperature l h l l h l undervoltage l h l l x x overvoltage l h l l h h output voltage > v ol l h h h l h output current < i ol l h l h h l table 13. electrical transient requirements iso t/r 7637/1 test pulse test level i ii iii iv delays and impedance 1- 25v (1) 1. all functions of the device are performed as designed after exposure to disturbance. - 50v (1) - 75v (1) - 100v (1) 2ms, 10 2 + 25v (1) + 50v (1) + 75v (1) + 100v (1) 0.2ms, 10 3a - 25v (1) - 50v (1) - 100v (1) - 150v (1) 0.1s, 50 3b + 25v (1) + 50v (1) + 75v (1) + 100v (1) 0.1s, 50 4- 4v (1) - 5v (1) - 6v (1) - 7v (1) 100ms, 0.01 5+ 26.5v (1) + 46.5v (2) 2. one or more functions of the device is not perfor med as designed after exposure and cannot be returned to proper operation without replacing the device. + 66.5v (2) + 86.5v (2) 400ms, 2
electrical specifications vn820-e 14/44 doc id 10890 rev 6 figure 6. waveforms open-load without external pull-up status input normal operation undervoltage v cc v usd v usdhyst input overvoltage v cc v cc > v ov status input status status input status input open-load with external pull-up undefined load voltage v cc v ol v ol
vn820-e electrical specifications doc id 10890 rev 6 15/44 2.4 electrical char acteristics curves figure 7. off-state output current figure 8. high-level input current figure 9. input clamp voltage f igure 10. status leakage current figure 11. status low output voltage figure 12. status clamp voltage -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 il(off1) (a) off state vcc=36v vin=vout=0v -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 iih (ua) vin=3.25v -50 -25 0 25 50 75 100 125 150 175 tc (c) 6 6.2 6.4 6.6 6.8 7 7.2 7.4 7.6 7.8 8 vicl (v) iin=1ma -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0.01 0.02 0.03 0.04 0.05 ilstat (ua) vstat=5v -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 vstat (v) istat=1.6ma -50 -25 0 25 50 75 100 125 150 175 tc (c) 6 6.2 6.4 6.6 6.8 7 7.2 7.4 7.6 7.8 8 vscl (v) istat=1ma
electrical specifications vn820-e 16/44 doc id 10890 rev 6 figure 13. on-state resistance vs t case figure 14. on-state resistance vs v cc figure 15. open-load on-state detection threshold figure 16. input high-level figure 17. input low-level figure 18. input hysteresis voltage -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 10 20 30 40 50 60 70 80 90 100 ron (mohm) iout=3a vcc=8v; 13v; 36v 5 10152025303540 vcc (v) 0 10 20 30 40 50 60 70 80 90 100 ron (mohm) tc= - 40oc tc= 25oc tc= 150oc -50 -25 0 25 50 75 100 125 150 175 tc (c) 50 60 70 80 90 100 110 120 130 140 150 iol (ma) vcc=13v vin=5v -50 -25 0 25 50 75 100 125 150 175 tc (c) 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 vih (v) -50 -25 0 25 50 75 100 125 150 175 tc (c) 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 vil (v) -50 -25 0 25 50 75 100 125 150 175 tc (c) 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 vhyst (v)
vn820-e electrical specifications doc id 10890 rev 6 17/44 figure 19. overvoltage shutdown figure 20. open-load off-state voltage detection threshold figure 21. turn-on voltage slope figure 22. turn-off voltage slope figure 23. i lim vs t case -50 -25 0 25 50 75 100 125 150 175 tc (c) 30 32 34 36 38 40 42 44 46 48 50 vov (v) -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 vol (v) vin=0v -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 100 200 300 400 500 600 700 800 900 1000 dvout/dt/(on) (v/ms) vcc=13v rl=6.5ohm -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 100 200 300 400 500 600 700 800 900 1000 dvout/dt(off) (v/ms) vcc=13v rl=4.3ohm -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 2 4 6 8 10 12 14 16 18 20 ilim (a) vcc=13v
application information vn820-e 18/44 doc id 10890 rev 6 3 application information figure 24. application schematic 3.1 gnd protection network against reverse battery 3.1.1 solution 1: resist or in the ground line (r gnd only) this can be used with any type of load. the following is an indication on how to dimension the r gnd resistor. 1. r gnd 600 mv / (i s(on)max ). 2. r gnd ( - v cc ) / (- i gnd ) where - i gnd is the dc reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. power dissipation in r gnd (when v cc < 0: during reverse battery situations) is: p d = (- v cc ) 2 / r gnd this resistor can be shared amongst several different hsds. please note that the value of this resistor should be calculated with formula (1) where i s(on)max becomes the sum of the maximum on-state currents of the different devices. please note that if the microprocessor ground is not shared by the device ground then the r gnd produces a shift (i s(on)max * r gnd ) in the input thresholds and the status output values. this shift varies depending on how many devices are on in the case of several high-side drivers sharing the same r gnd . if the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then st suggest s to utilize solution 2 (see below). v cc gnd output d gnd r gnd d ld c +5v r prot v gnd status input +5v r prot
vn820-e application information doc id 10890 rev 6 19/44 3.1.2 solution 2: diode (d gnd ) in the ground line a resistor (r gnd = 1k ) should be inserted in parallel to d gnd if the device drives an inductive load. this small signal diode can be safely shared amongst several different hsds. also in this case, the presence of the ground network produces a shift ( 600 mv) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. this shift not varies if more than one hsd shares the same diode/resistor network. series resistor in input and status lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. safest configuration for unused input and status pin is to leave them unconnected. 3.2 load dump protection d ld is necessary ( voltage transient suppressor ) if the load dump peak voltage exceeds the v cc max dc rating. the same applies if the device is subject to transients on the v cc line that are greater than the ones shown in the iso 7637-2: 2004(e) table. 3.3 mcu i/os protection if a ground protection network is used and negative transient are present on the v cc line, the control pins are pulled negative. st suggests to insert a resistor (r prot ) in line to prevent the c i/os pins to latch-up. the value of these resistors is a compromise between the leakage current of c and the current required by the hsd i/os (input levels compatibilit y) with the latch-up limit of c i/os. -v ccpeak /i latchup r prot (v oh c -v ih -v gnd ) / i ihmax calculation example: for v ccpeak = - 100 v and i latchup 20 ma; v oh c 4.5 v 5k r prot 65 k . recommended values: r prot =10 k . 3.4 open-load detecti on in off-state off-state open-load detection requires an external pull-up resistor (r pu ) connected between output pin and a positive supply voltage (v pu ) like the +5 v line used to supply the microprocessor. the external resistor has to be selected according to the following requirements: 1. no false open-load indication when load is connected: in this case we have to avoid v out to be higher than v olmin ; this results in the following condition v out = (v pu / (r l +r pu )) r l < v olmin . 2. no misdetection when load is di sconnected: in this case the v out has to be higher than v olmax ; this results in the following condition r pu < (v pu ? v olmax ) / i l(off2) .
application information vn820-e 20/44 doc id 10890 rev 6 because i s(off) may significantly increase if v out is pulled high (up to several ma), the pull- up resistor r pu should be connected to a supply that is switched off when the module is in standby. the values of v olmin , v olmax and i l(off2) are available in the electrical characteristics section. figure 25. open-load detection in off-state v ol v batt. v pu r pu r l r driver + logic + - input status v cc out ground i l(off2)
vn820-e application information doc id 10890 rev 6 21/44 3.5 powerso-10, p 2 pak, ppak, pentawatt maximum demagnetization energy (v cc = 13.5v) figure 26. powerso-10, p 2 pak, ppak, pentawatt maximum turn-off current versus inductance note: values are generated with r l = 0 . in case of repetitive pulses, t jstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves a and b. c: t jstart = 125c repetitive pulse a: t jstart = 150c single pulse b: t jstart = 100c repetitive pulse demagnetization demagnetization demagnetization t v in , i l 1 10 100 0.1 1 10 100 l (mh) imax (a) a b c
package and pcb thermal data vn820-e 22/44 doc id 10890 rev 6 4 package and pcb thermal data 4.1 p 2 pak thermal data figure 27. p 2 pak pc board note: layout condition of r th and z th measurements (pcb fr4 area = 60 mm x 60 mm, pcb thickness = 2 mm, cu thickness = 35 m , copper areas: 0.97 cm 2 , 8 cm 2 ). figure 28. p 2 pak r thj-amb vs pcb copper area in open box free air conditions 30 35 40 45 50 55 0246810 pcb cu heatsink area (cm^2) rthj_amb (c/w) tj-tamb=50c
vn820-e package and pcb thermal data doc id 10890 rev 6 23/44 figure 29. p 2 pak thermal impedance junction ambient single pulse equation 1: pulse calculation formula where = t p /t figure 30. thermal fitting model of a single channel hsd in p 2 pak 0.01 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zt h (c /w) 0.97 cm 2 6 cm 2 z th r th z thtp 1 ? () + ? =
package and pcb thermal data vn820-e 24/44 doc id 10890 rev 6 table 14. p 2 pak thermal parameters area/island (cm 2 )0.976 r1 (c/w) 0.04 r2 (c/w) 0.25 r3 (c/w) 0.3 r4 (c/w) 4 r5 (c/w) 9 r6 (c/w) 37 22 c1 (ws/c) 0.0008 c2 (ws/c) 0.007 c3 (ws/c) 0.015 c4 (ws/c) 0.4 c5 (ws/c) 2 c6 (ws/c) 3 5
vn820-e package and pcb thermal data doc id 10890 rev 6 25/44 4.2 ppak thermal data figure 31. ppak pc board note: layout condition of r th and z th measurements (pcb fr4 area = 60 mm x 60 mm, pcb thickness = 2 mm, cu thickness=35 m , copper areas: 0.44 cm 2 , 8 cm 2 ). figure 32. ppak r thj-amb vs pcb copper area in open box free air conditions 0 10 20 30 40 50 60 70 80 90 0246810 pcb cu heatsink area (cm^2) rthj_amb (oc/w)
package and pcb thermal data vn820-e 26/44 doc id 10890 rev 6 figure 33. ppak thermal impedance junction ambient single pulse equation 2: pulse calculation formula where = t p /t figure 34. thermal fitting model of a single channel hsd in ppak 0.01 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zth (c/w) 0.44 cm 2 6 cm 2 z th r th z thtp 1 ? () + ? =
vn820-e package and pcb thermal data doc id 10890 rev 6 27/44 table 15. ppak thermal parameters area/island (cm 2 )0.446 r1 (c/w) 0.04 r2 (c/w) 0.25 r3 (c/w) 0.3 r4 (c/w) 2 r5 (c/w) 15 r6 (c/w) 61 24 c1 (ws/c) 0.0008 c2 (ws/c) 0.007 c3 (ws/c) 0.02 c4 (ws/c) 0.3 c5 (ws/c) 0.45 c6 (ws/c) 0.8 5
package and pcb thermal data vn820-e 28/44 doc id 10890 rev 6 4.3 powerso-10 thermal data figure 35. powerso-10 pc board note: layout condition of r th and z th measurements (pcb fr4 area = 58 mm x 58 mm, pcb thickness = 2 mm, cu thickness = 35 m, copper areas: from minimum pad lay-out to 8cm 2 ). figure 36. powerso-10 r thj-amb vs pcb copper area in open box free air conditions 30 35 40 45 50 55 0246810 pcb cu heatsink area (cm^2) rthj_amb (c/w) tj-tamb=50c
vn820-e package and pcb thermal data doc id 10890 rev 6 29/44 figure 37. powerso-10 thermal impeda nce junction ambient single pulse equation 3 : pulse calculation formula figure 38. thermal fitting model of a single channel hsd in powerso-10 0.01 0.1 1 10 100 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zth (c/w ) 0.5 cm 2 6 cm 2 z th r th z thtp 1 ? () + ? = where t p t ? = t_amb c1 r1 r2 c2 r3 c3 r4 c4 r5 c5 r6 c6 pd tj
package and pcb thermal data vn820-e 30/44 doc id 10890 rev 6 table 16. powerso-10 thermal parameters area / island (cm 2 ) footprint 6 r1 (c/w) 0.04 r2 (c/w) 0.25 r3 (c/w) 0.25 r4 (c/w) 0.8 r5 (c/w) 12 r6 (c/w) 37 22 c1 (w.s/c) 0.0008 c2 (w.s/c) 7e-03 c3 (w.s/c) 0.015 c4 (w.s/c) 0.3 c5 (w.s/c) 0.75 c6 (w.s/c) 3 5
vn820-e package and packing information doc id 10890 rev 6 31/44 5 package and packing information 5.1 ecopack ? packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com. ecopack ? is an st trademark. 5.2 pentawatt mechanical data figure 39. pentawatt package dimensions
package and packing information vn820-e 32/44 doc id 10890 rev 6 table 17. pentawatt mechanical data dim. mm min. typ. max. a 4.8 c 1.37 d2.4 2.8 d1 1.2 1.35 e 0.35 0.55 f 0.8 1.05 f1 1 1.4 g3.23.43.6 g1 6.6 6.8 7 h2 10.4 h3 10.05 10.4 l17.85 l1 15.75 l2 21.4 l3 22.5 l5 2.6 3 l6 15.1 15.8 l7 6 6.6 m4.5 m1 4 diam. 3.65 3.85
vn820-e package and packing information doc id 10890 rev 6 33/44 5.3 p 2 pak mechanical data figure 40. p 2 pak package dimensions p010r
package and packing information vn820-e 34/44 doc id 10890 rev 6 table 18. p 2 pak mechanical data dim. mm min. typ. max. a 4.30 4.80 a1 2.40 2.80 a2 0.03 0.23 b 0.80 1.05 c 0.45 0.60 c2 1.17 1.37 d 8.95 9.35 d2 8.00 e 10.00 10.40 e1 8.50 e 3.20 3.60 e1 6.60 7.00 l 13.70 14.50 l2 1.25 1.40 l3 0.90 1.70 l5 1.55 2.40 r 0.40 v2 0o 8o package weight 1.40 gr (typ)
vn820-e package and packing information doc id 10890 rev 6 35/44 5.4 ppak mechanical data figure 41. ppak package dimensions
package and packing information vn820-e 36/44 doc id 10890 rev 6 table 19. ppak mechanical data dim. mm min. typ. max. a 2.20 2.40 a1 0.90 1.10 a2 0.03 0.23 b 0.40 0.60 b2 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 d1 5.1 d 6.00 6.20 e 6.40 6.60 e1 4.7 e1.27 g 4.90 5.25 g1 2.38 2.70 h 9.35 10.10 l2 0.8 1.00 l4 0.60 1.00 r0.2 v2 0o 8o package weight gr. 0.3
vn820-e package and packing information doc id 10890 rev 6 37/44 5.5 powerso-10 mechanical data figure 42. powerso-10 package dimensions detail "a" plane seating l a1 f a1 h a d d1 = = = = e4 0.10 a e c a b b detail "a" seating plane e2 10 1 eb he 0.25
package and packing information vn820-e 38/44 doc id 10890 rev 6 table 20. powerso-10 mechanical data dim. mm min. typ. max. a 3.35 3.65 a (1) 1. muar only poa p013p. 3.4 3.6 a1 0 0.10 b 0.40 0.60 b (1) 0.37 0.53 c 0.35 0.55 c (1) 0.23 0.32 d 9.40 9.60 d1 7.40 7.60 e 9.30 9.50 e2 7.20 7.60 e2 (1) 7.30 7.50 e4 5.90 6.10 e4 (1) 5.90 6.30 e1.27 f 1.25 1.35 f (1) 1.20 1.40 h 13.80 14.40 h (1) 13.85 14.35 h0.50 l 1.20 1.80 l (1) 0.80 1.10 0 8 (1) 2 8
vn820-e package and packing information doc id 10890 rev 6 39/44 5.6 pentawatt packing information figure 43. pentawatt tube shipment (no suffix) 5.7 p 2 pak packing information figure 44. p 2 pak tube shipme nt (no suffix) all dimensions are in mm. base q.ty 50 bulk q.ty 1000 tube length ( 0.5) 532 a 18 b 33.1 c ( 0.1) 1 c b a all dimensions are in mm. base q.ty 50 bulk q.ty 1000 tube length ( 0.5) 532 a 18 b 33.1 c ( 0.1) 1 c b a
package and packing information vn820-e 40/44 doc id 10890 rev 6 figure 45. p 2 pak tape and reel (suffix ?tr?) 5.8 ppak packing information figure 46. ppak suggested pad layout tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb 1986 all dimensions are in mm. tape width w 24 tape hole spacing p0 ( 0.1) 4 component spacing p 12 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 11.5 compartment depth k (max) 6.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed reel dimensions all dimensions are in mm . base q.ty 1000 bulk q.ty 1000 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 24.4 n (min) 60 t (max) 30.4 6.7 1.8 3
vn820-e package and packing information doc id 10890 rev 6 41/44 figure 47. ppak tube shipment (no suffix) figure 48. ppak tape and reel (suffix ?tr?) all dimensions are in mm. base q.ty 75 bulk q.ty 3000 tube length ( 0.5) 532 a 6 b 21.3 c ( 0.1) 0.6 a c b all dimensions are in mm base q.ty 2500 bulk q.ty 2500 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 16.4 n (min) 60 t (max) 22.4 tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb 1986 all dimensions are in mm. tape width w 16 tape hole spacing p0 ( 0.1) 4 component spacing p 8 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 7.5 compartment depth k (max) 2.75 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed reel dimensions
package and packing information vn820-e 42/44 doc id 10890 rev 6 5.9 powerso-10 packing information figure 51. powerso-10 tape and reel shipment (suffix ?tr?) figure 49. powerso-10 suggested pad layout figure 50. powerso-10 tube shipment (no suffix) 6. 30 10.8 - 11 14.6 - 14.9 9.5 1 2 3 4 5 1.27 0.67 - 0.73 0. 54 - 0.6 10 9 8 7 6 b a c all dimensions are in mm. base q.ty bulk q.ty tube length ( 0.5) a b c ( 0.1) casablanca 50 1000 532 10.4 16.4 0.8 muar 50 1000 532 4.9 17.2 0.8 c a b muar casablanca base q.ty 600 bulk q.ty 600 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 24.4 n (min) 60 t (max) 30.4 tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb. 1986 all dimensions are in mm. tape width w 24 tape hole spacing p0 ( 0.1) 4 component spacing p 24 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 11.5 compartment depth k (max) 6.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed reel dimensions
vn820-e revision history doc id 10890 rev 6 43/44 6 revision history table 21. document revision history date revision changes 07-dec-2004 1 initial release. 09-feb-2005 2 text changed. 23-mar-2005 3 configuration diagram (powerso-10) modification. 03-may-2006 4 so-16l mechanical and shipment data insertion. 17-dec-2008 5 document reformatted and restructured. added content, list of figures and tables. added ecopack ? packages information. updated figure 45: p 2 pak tape and reel (suffix ?tr?) : ? changed component spacing (p) in tape dimensions table from 16 mm to 12 mm. 29-03-2010 6 updated features list. updated table 1: device summary . updated table 3: absolute maximum ratings . updated section 3.5: powerso-10, p 2 pak, ppak, pentawatt maximum demagnetization energy (v cc = 13.5v) . removed so-16l package into the document.
vn820-e 44/44 doc id 10890 rev 6 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military , air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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